Co-Packaged Optical Modules for HPC, Data Center and AI Applications

Abstract : This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Co-sponsored by: McGill Optica Student Chapter Speaker(s): Daniel M. Kuchta Room: MD267, Bldg: Macdonald Engineering Building, McGill University, 817 Sherbrooke St W, Montreal, Quebec, Canada, H3A 0C3