Co-Packaged Optical Modules for HPC, Data Center and AI Applications
August 14 @ 10:30 am - 12:00 pm UTC
Abstract : This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Co-sponsored by: C2MI. Speaker(s): Daniel M. Kuchta Agenda: 9h45-10h30: arrival of participants on-site, coffee and networking 10:30am-11:30am: Tech Talk (hybrid) 11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members 12pm: departure and end of event Bldg: C2MI, C2MI, 45 Blvd de l’Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772