Webinar on Ansys Electronics 2022 R1: Phi Plus meshing, Automotive Radar Surface Roughness, and Broadband Fast Sweep

Ansys Electronics 2022 R1 • Phi Plus meshing technology introduced in 2021 R2 brought a significant breakthrough in speed and capacity for 3D IC package challenges, especially those with wire bonds. In 2022 R1, Phi-plus technology is now fully integrated into the powerful HFSS Mesh Fusion technology which will allow HFSS users to solve even more complex and large-scale electromagnetic system designs. • An automotive radar surface roughness model in HFSS SBR+ provides an efficient method for modeling rough surface non-specular reflection such as from asphalt or concrete boosting the realism of radar simulation outputs. • Broadband Fast Sweep provides faster solutions with less computational effort by requiring fewer solved basis points to deliver broadband simulation outputs Speaker(s): Dr. Laila Salman, Virtual: https://events.vtools.ieee.org/m/306249