IEEE Vancouver @ Worldcon 2025 in Seattle

Bldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

[] Hi IEEE Members and Student Members in Vancouver, As you may know, the World Science Fiction Convention is coming to Seattle from 13-17 August 2025! Attendees at this event have the right to cast a vote for the winners of the Hugo award! (https://seattlein2025.org/) IEEE will be there, and you have an opportunity to attend and contribute as an IEEE member or student member alongside your peers from Seattle Section for a day, for a few days, or for the entire event. We’re hoping for a good turnout from Vancouver on the weekend: Fri, 15 August, Sat, 16 August and Sun, 17 August. Instructions for registering for the conference can be found at https://seattlein2025.org/memberships/memberships/ . You have multiple options including day passes, full conference registration, etc. IEEE will have a booth at Worldcon. If you would like to volunteer to join a shift or two, please let us know! IEEE members like myself, Alon Newton, John Vertner, and Tom Coughlin (2024 President) will be at Worldcon. We hope that you can join us! In the meantime, please help us plan ahead by registering through this vTools page so that we can gauge interest and keep you informed. At this point, you’re simply expressing interest. Final confirmation won’t be required for a week or two. David Michelson Counsellor, IEEE Student Branch @ UBC Bldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

Co-Packaged Optical Modules for HPC, Data Center and AI Applications

Bldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772

Abstract : This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Co-sponsored by: C2MI. Speaker(s): Daniel M. Kuchta Agenda: 9h45-10h30: arrival of participants on-site, coffee and networking 10:30am-11:30am: Tech Talk (hybrid) 11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members 12pm: departure and end of event Bldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772

Research and Industry Shaping the 6G Era: Intelligent, Resilient and Inclusive Socio-Economic Transformation

Room: 4026, Bldg: SITE, 800 King Edward Avenue, Ottawa, Ontario, Canada, K1N 1A2

This talk shares an independent perspective on how industry and research meet and how together they potentially shape and transform the next decade and beyond. This is outlined in the context of expected paradigm shifts in global intelligent and resilient connectivity, with multi-modal and multi-sensory immersive interaction and digital world experience, autonomous swarms, intelligent agents, and man-machine collaboration, and environmental awareness. It highlights the journey of related research topics, their transformative potentials, and the associated questions and challenges, in an end-to-end context and path, towards a seamless, inclusive, and sustainable socio-economic transformation. Speaker(s): Javan Erfanian, Room: 4026, Bldg: SITE, 800 King Edward Avenue, Ottawa, Ontario, Canada, K1N 1A2

Research and Industry Shaping the 6G Era: Intelligent, Resilient and Inclusive Socio-Economic Transformation

Room: 4026, Bldg: SITE, 800 King Edward Avenue, Ottawa, Ontario, Canada, K1N 1A2

This talk shares an independent perspective on how industry and research meet and how together they potentially shape and transform the next decade and beyond. This is outlined in the context of expected paradigm shifts in global intelligent and resilient connectivity, with multi-modal and multi-sensory immersive interaction and digital world experience, autonomous swarms, intelligent agents, and man-machine collaboration, and environmental awareness. It highlights the journey of related research topics, their transformative potentials, and the associated questions and challenges, in an end-to-end context and path, towards a seamless, inclusive, and sustainable socio-economic transformation. Speaker(s): Javan Erfanian, Room: 4026, Bldg: SITE, 800 King Edward Avenue, Ottawa, Ontario, Canada, K1N 1A2

Co-Packaged Optical Modules for HPC, Data Center and AI Applications

Room: MD267, Bldg: Macdonald Engineering Building, McGill University, 817 Sherbrooke St W, Montreal, Quebec, Canada, H3A 0C3

Abstract : This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Co-sponsored by: McGill Optica Student Chapter Speaker(s): Daniel M. Kuchta Room: MD267, Bldg: Macdonald Engineering Building, McGill University, 817 Sherbrooke St W, Montreal, Quebec, Canada, H3A 0C3

IEEE ComSoc Distinguished Lecture – Neuro-symbolic AI: The Third Wave of AI

Room: SB415, Bldg: Sobey Building, Saint Mary's University, 903 Robie St, Halifax, Nova Scotia, Canada, B3H 3C2, Virtual: https://events.vtools.ieee.org/m/494412

Join us for an exclusive IEEE Communications Society Distinguished Lecture featuring Prof. Houbing Herbert Song. Discover how neuro-symbolic AI merges neural networks with symbolic reasoning to unlock machines that move beyond data-driven learning to autonomously perceive, understand, reason, and learn directly from the world, ushering in the transformative Third Wave of Artificial Intelligence. Speaker(s): Dr. Houbing Herbert Song, Room: SB415, Bldg: Sobey Building, Saint Mary's University, 903 Robie St, Halifax, Nova Scotia, Canada, B3H 3C2, Virtual: https://events.vtools.ieee.org/m/494412

Research and Industry Shaping the 6G Era

Room: EV003-309, Bldg: Electrical & Computer Engineering Department EV, Concordia University, 1515 Ste. Catherine West, MONTREAL, Quebec, Canada, H3G 1M8

Abstract : This talk shares an independent perspective on how industry and research meet and how together they potentially shape and transform the next decade and beyond. This is outlined in the context of expected paradigm shifts in global intelligent and resilient connectivity, with multi-modal and multi-sensory immersive interaction and digital world experience, autonomous swarms, intelligent agents, and man-machine collaboration, and environmental awareness. It highlights the journey of related research topics, their transformative potentials, and the associated questions and challenges, in an end-to-end context and path, towards a seamless, inclusive, and sustainable socio-economic transformation. Co-sponsored by: [email protected] Speaker(s): Dr. Javan Erfanian, Room: EV003-309, Bldg: Electrical & Computer Engineering Department EV, Concordia University, 1515 Ste. Catherine West, MONTREAL, Quebec, Canada, H3G 1M8